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| IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 OptiMOS(R)-T2 Power-Transistor Product Summary V DS R DS(on),max (SMD version) ID 55 24.8 25 V m A Features * N-channel - Enhancement mode * Automotive AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green product (RoHS compliant) * 100% Avalanche tested PG-TO263-3-2 PG-TO262-3-1 PG-TO220-3-1 Type IPB25N06S3-25 IPI25N06S3-25 IPP25N06S3-25 Package PG-TO263-3-2 PG-TO262-3-1 PG-TO220-3-1 Marking 3N0625 3N0625 3N0625 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current1) Symbol ID Conditions T C=25 C, V GS=10 V T C=100 C, V GS=10 V2) Pulsed drain current2) Avalanche energy, single pulse2) Avalanche current, single pulse Gate source voltage3) Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS I AS V GS P tot T j, T stg T C=25 C T C=25 C I D=12.5 A Value 25 23 50 120 25 20 48 -55 ... +175 55/175/56 mJ A V W C Unit A Rev. 1.1 page 1 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 Parameter Symbol Conditions min. Thermal characteristics2) Thermal resistance, junction - case Thermal resistance, junction ambient, leaded SMD version, device on PCB R thJC R thJA R thJA minimal footprint 6 cm2 cooling area4) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=20 A V DS=55 V, V GS=0 V, T j=25 C V DS=55 V, V GS=0 V, T j=125 C2) Gate-source leakage current Drain-source on-state resistance I GSS RDS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=15 A V GS=10 V, I D=15 A, SMD version 55 2.1 3.0 4.0 1 A V 3.3 62 62 40 K/W Values typ. max. Unit - 1 1 21.6 21.3 100 100 25.1 24.8 nA m Rev. 1.1 page 2 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 Parameter Symbol Conditions min. Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode2) Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge 1) Values typ. max. Unit C iss C oss Crss t d(on) tr t d(off) tf V DD=27.5 V, V GS=10 V, I D=25 A, R G=14.8 V GS=0 V, V DS=25 V, f =1 MHz - 1862 283 270 15 27 16 27 - pF ns Q gs Q gd Qg V plateau V DD=11 V, I D=25 A, V GS=0 to 10 V - 14 6 27 7.0 41 - nC V IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=25 A, T j=25 C V R=27.5 V, I F=I S, di F/dt =100 A/s 0.6 - 0.9 15 15 25 50 1.3 - A V ns nC Current is limited by bondwire; with an R thJC = 3.3 K/W the chip is able to carry 30 A at 25C. For detailed information see Application Note ANPS071E 2) 3) 4) Defined by design. Not subject to production test. Qualified at -5V and +20V. Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.1 page 3 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 60 30 50 25 40 20 P tot [W] 30 I D [A] 0 50 100 150 200 15 20 10 10 5 0 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 100 1 s 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 0.5 10 s 100 s 1 ms 100 0.1 Z thJC [K/W] 0.05 I D [A] 10 10 -1 0.01 10-2 single pulse 1 0.1 1 10 100 10-3 10-7 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.1 page 4 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 50 10 V 8V 6 Typ. drain-source on-state resistance R DS(on) = f(I D); T j = 25 C parameter: V GS 55 5.5 V 6V 40 45 7V 7V R DS(on) [m] 30 I D [A] 35 8V 20 6V 25 10 V 10 5V 0 0 2 4 6 8 15 0 10 20 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 6V parameter: T j 60 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 25 A; V GS = 10 V 45 50 40 40 -55 C 35 R DS(on) [m] 8 I D [A] 25 C 30 30 175 C 25 20 20 10 15 0 0 1 2 3 4 5 6 7 10 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.1 page 5 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 4 104 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 3.5 3 C [pF] 200A Ciss V GS(th) [V] 20A 2.5 103 Coss 2 Crss 1.5 1 -60 -20 20 60 100 140 180 102 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 102 12 Typ. avalanche characteristics I A S= f(t AV) parameter: T j(start) 100 101 I AV [A] 150C 100C 25C I F [A] 10 175 C 25 C 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 0.1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.1 page 6 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 13 Typical avalanche energy E AS = f(T j) parameter: I D 300 66 64 250 6.25 A 14 Typ. drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 62 60 200 V BR(DSS) [V] 58 56 54 52 E AS [mJ] 150 12.5 A 100 50 25 A 50 48 0 0 50 100 150 200 46 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 25 A pulsed parameter: V DD 12 16 Gate charge waveforms 11 V 44 V V GS Qg 10 8 V GS [V] 6 4 2 Q gs Q gd Q gate 0 0 10 20 30 40 50 Q gate [nC] Rev. 1.1 page 7 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2007 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 page 8 2007-11-07 IPB25N06S3-25 IPI25N06S3-25, IPP25N06S3-25 Revision History Version Date Changes Data Sheet 2.1 15.12.2006 Removal of ordering code Implementation of avalanche 15.12.2006 current single pulse Data Sheet 2.1 Data Sheet 2.1 15.12.2006 Removal of ESD class Data Sheet 2.1 15.12.2006 Update of Infineon address Removal of foot note 3, avalanche 15.12.2006 diagrams Data Sheet 2.1 Data Sheet 2.1 15.12.2006 Pulse current from 100A to 50A Data Sheet 2.1 15.12.2006 Update of Qrr and trr Data Sheet 2.1 15.12.2006 Update of disclaimer Implementation of RoHS and AEC 15.12.2006 logo, update of feature list Data Sheet 2.1 Data Sheet 1.1 07.11.2007 Update of data sheet layout Data Sheet 1.1 07.11.2007 Adaptation of Ias implementation of footnote 2 for 07.11.2007 Eas specification removal of Vdg specification from 07.11.2007 data sheet Data Sheet 1.1 Data Sheet 1.1 Rev. 1.1 page 9 2007-11-07 |
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